Accessories

This thermal paste can be used to improve the effectiveness of a CPU cooler by thermally bonding the CPU to the heatsink allowing the heatsink and fan to work more efficiently to remove the harmful heat away from the CPU.

Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This...

Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink - a high quality solution that helps to ensure maximum dissipation of heat generated by the CPU.